Harris Products Group, SCPF4POP, Paste Soldering Flux, 4 oz jar, Up to 600 F, Copper-to-Copper, Copper-to-Brass

STAY-CLEAN® paste soldering flux was designed primarily for copper-to-copper and copper-to-brass connection. In its paste form it is ideal for soldering tube joints. It is not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. This flux works well with most leaded and lead-free solder compositions. The flux residue should be removed after soldering.

Applicatiotns

• Can be used with select plumbing applications (check applicable plumbing codes)
• Soldering copper and brass and some grades of clean steel

Prop 65 Warning

• Carbon monoxide, 630-08-0

Features

• Superior paste soldering flux for most metals except aluminum, magnesium or titanium.
• Conforms to the EU RoHS directive
• Due to the corrosive nature of the flux residue, this product is not recommended for use in electrical or electronic applications.
• Works well with most leaded and lead-free solder compositions
• Designed for copper-to-copper and copper-to-brass connections as well as copper, brass, bronze, steel, galvanized steel and Monel®.
• Ideal for soldering Tube joints

Included

• STAY-CLEAN® Paste Soldering Flux 4oz jar POP

Certifications and Standards

• Reach
• Rohs

• Effective Temperature Range: Up to 600 F (316 C)
• Working Temperature Range: 350 F - 600 F (177 C - 316 C)
• Weight: 0.35 lb (4 oz)
• Size: 4 oz jar
• Material Compatibility: Copper, Brass, Bronze, Steel, Galvanized Steel, Monel
• Product Type: Paste soldering flux
• Classification: A-51145 D Type 1 Form A | O-F-506 C Type 1 Form A
• RoHS Compliant: True
• Country of Origin: United States
• Chemical Composition: Ethylene Glycol, Ammonium Chloride, Zinc Chloride, Petrolatum, Water

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