Harris Products Group, 5520R, Brazing Alloy, Medium Range, Phos-Copper, Copper-to-Copper, Self-Fluxing

Stay-Silv® 5 phos-copper filler metal is a medium range filler metal that is well suited where close fit-up cannot be maintained. This filler metal is somewhat more ductile than Harris® 0 or Stay-Silv® 2. It is designed for copper-to-copper applications, but also can be used on copper to low zinc brass by applying Stay-Silv® white brazing flux. Stay-Silv® 5 flows rapidly when heated quickly to its liquidus. This allows penetration into tight clearance connections. With slower heating, the filler metal melting range provides the ability to fill wider gaps. Stay-Silv® 5 is often chosen as an economical alternative to higher silver content filler metals for copper and brass applications. It is not recommended for brazing steel or other ferrous base metals, as the phosphorus content promotes formation of low ductility intermetallic with the base metal. Corrosion resistance is generally similar to copper base metal, but due to its phosphorus content should not be used if the braze is exposed to sulfur or sulfur compounds in service. Complies with the EU Reach & RoHS directive.

Features

• Complies with the EU Reach & RoHS directive
• The phosphorus content promotes formation of a low ductility intermetallic with the base metal
• Corrosion resistance is generally similar to the copper base metal, but phosphorus containing alloys, including Stay-Silv® 5, should not be used if the braze is exposed to sulfur or sulfur compounds in service
• A frequent choice for brazing copper as it is "self-fluxing"
• With slower heating, the alloy melting range allows the operator to fill loose connections
• Not recommended for brazing steel or other ferrous metals due to sufficient lack of joint ductility
• More ductile than Harris® 0 or Stay-Silv® 2
• Medium-range silver brazing alloy for copper-to-copper applications
• Use Stay-Silv® white flux to braze low-zinc brass
• When heated quickly to its liquidus, allows penetration into tight clearance connections

• Weight: 1.03 lbs
• Phosphorus Content: 5.9%
• Silver Content: 5.0%
• Other Elements Content: 0.15%
• Copper Content: Remainder
• Solidus Temperature: 1190 F (643 C)
• Liquidus Temperature: 1500 F (815 C)
• Brazing Range: 1350 F - 1550 F (723 C - 843 C)
• Electrical Conductivity: 5.6% IACS
• Density: 0.280 lb/cu.in.
• Suitability: Copper to copper, copper to low zinc brass
• Flux Requirement: No flux for copper to copper; Stay-Silv white flux for brass
• Compatibility: Not recommended for steel or ferrous metals
• Corrosion Resistance: Similar to copper, avoid exposure to sulfur compounds
• Compliance: EU Reach, RoHS, AWS A5.8 BCuP-3, ASME SFA 5.8 BCuP-3, ISO 17672 CuP 281

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